Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0fb905106eeabff9660bc073fb748ac5 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01C19-5656 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P3-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01C19-5656 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 |
filingDate |
1999-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bd79794a504cc926d68f74a87592506 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a330f98f47084c223cecd5b92a2e1892 |
publicationDate |
2000-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20000028948-A |
titleOfInvention |
Method for manufacturing an angular rate sensor |
abstract |
The present invention relates to a method for manufacturing an angular velocity sensor by fabricating a component of an angular velocity sensor on a silicon substrate comprising at least one mass, a support beam and a buried conductor. Sensing means are provided, and the components are sealed in the cavity between the first glass plate and the second glass plate by anodic bonding. This allows angular velocity sensors to be fabricated using low cost silicon wafers. |
priorityDate |
1998-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |