| abstract |
The thermosetting resin composition for buildup methods containing (A) epoxy resin which has a 2 or more glycidyl group, the hardening | curing agent for epoxy resins, (C) poly (ether sulfone), and (D) inorganic filler is provided. The thermosetting resin composition is free from workability degradation as found in the prior art, and provides a cured product excellent in low thermal expansion and low water absorbency. |