| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
1999-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_894e8bb377190626fbe5607f6e06814c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66f8f7617ddf6f08e1be1fea52d4f713
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc125a64842b94689f039e8d956052fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_287439cbd3e86d7bf213becdf0b943ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0466eee2f52e7ba2a8c786098d78c08f |
| publicationDate |
2000-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20000028683-A |
| titleOfInvention |
A method for forming self-aligned features |
| abstract |
The present invention provides an improved method for forming vias and trenches in the manufacturing process of microchips. According to the present invention, vias and trenches are self-aligned during the photolithography process by the use of two resist layers specifically selected such that the lower resist layer is exposed only in the openings formed in the upper photoresist layer and the exposure of the resist layers. . This self alignment can be printed in elongated form to use a very effective imaging enhancement technique. In addition, the present invention provides a method for simplifying the formation of vias and trenches by simultaneously forming vias and trenches in one etching step. In another embodiment of the present invention, individual features may be formed by cutting looped or linked images by printing by an image improvement technique or the like. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9209129-B2 |
| priorityDate |
1998-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |