| abstract |
The present invention,n n n (A) an epoxy resin having 2 nuclei of 10 wt% or less, a total amount of 3 to 5 nuclei of 50 wt% or more, and a weight average molecular weight of 1.7 or less,n n n (B) inorganic fillers,n n n (C) curing catalyst andn n n (D) phenolic resin as requiredn n n And an glass transition temperature of the uncured product is less than 15 ° C.n n n By controlling the molecular weight distribution of the epoxy resin, the epoxy resin composition of the present invention can lower the glass transition temperature of the uncured product without lowering the heat resistance and the moisture resistance of the cured product. A favorable film is obtained, and the layer of this epoxy resin composition is made into one layer, and the laminated film which attached two or more layers according to the use can be obtained, and a semiconductor element is coat | covered with this film, and heat resistance, moisture resistance, and low A semiconductor device having good stress properties is obtained. |