http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20000008936-U
Outgoing Links
| Predicate | Object |
|---|---|
| filingDate | 1998-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2000-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20000008936-U |
| titleOfInvention | Semiconductor Shiobi Package |
| abstract | The present invention relates to a semiconductor Shiobi package, and at least two chips 13 are attached to the center of the top surface of the Shiobi film 11, and the patterns formed on the chips 13 and the Shiobi film 11 ( 11b) are connected to the metal wires 14, and the molding part 15 is formed to surround the chip 13 and the upper surface of the metal wires 14 to embed several chips in one package. High integration is possible, and it is possible to cope with high functionalization of electronic products. |
| priorityDate | 1998-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID71586773 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID428438116 |
Total number of triples: 9.