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filingDate 1999-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1999-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-19990088071-A
titleOfInvention Epoxy Resin Compositions and Semiconductor Devices Encapsulated Therewith
abstract An epoxy resin composition comprising an epoxy resin, a curing agent, and at least 70 wt% inorganic filler, wherein at least one of the epoxy resin and the curing agent has a molecular weight distribution providing an average molecular weight distribution Mw / Mn of less than 1.6, wherein the amount of the binary nucleus This amount is less than 8% by weight, and the total amount of seven or more nuclei is less than 32% by weight. When the composition is cured at 180 ° C. for 90 seconds to make Tg1 the same primary product, and the primary product is cured at 180 ° C. for 5 hours to be a secondary product having Tg 2,n n n n n (Tg2-Tg1) / Tg2 <0.1n n n n n The relationship of the following equation 1 is satisfied.n n n The composition is cured to a fast curable, effective formability and a reliable product without the need for postcure.
priorityDate 1998-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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