http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19990086257-A
Outgoing Links
| Predicate | Object |
|---|---|
| filingDate | 1998-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-19990086257-A |
| titleOfInvention | Manufacturing method of chip type solid electrolytic capacitor |
| abstract | The present invention forms a dielectric oxide film layer (5) on a metal plate of a size capable of manufacturing a plurality of solid electrolytic capacitors, and divides the dielectric oxide film into parts capable of manufacturing a plurality of solid electrolytic capacitors, each of which comprises an anode lead-out portion, A first insulating film, a conductive film, a precursor layer, a solid electrolyte layer, and a cathode layer are sequentially formed on each part to manufacture a plurality of solid electrolytic capacitor devices, and the lead frame is electrically cut by cutting each part of the manufactured device. The present invention relates to a method of manufacturing a chip-shaped solid electrolytic capacitor by connecting to a mass production of a chip type electrolytic capacitor. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100775023-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115512966-A |
| priorityDate | 1998-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.