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filingDate 1999-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1999-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-19990083294-A
titleOfInvention Semiconductor device and manufacturing method of the same
abstract The semiconductor device includes at least a connection portion of a tantalum metal serving as a barrier metal film; The connection degree between this connection part and the copper-embedded wiring connected is improved and reliability is improved by preventing peeling of a copper-embedded wiring. A tantalum film having a film thickness of 200 to 500 ohms strong in a trench designed for buried wiring of an interlayer insulating film; A copper buried wiring with a film thickness of 1.1 to 1.15 mu m is formed. This copper buried wiring is formed by laminating together a copper thin film having a film thickness of 0.08 to 0.12 mu m and a copper thick film having a film thickness of 1.0 to 1.5 mu m. Furthermore, an amorphous metal film having a thickness of about several ohms is formed between the tantalum film and the copper buried wiring. Further, a tantalum film having a film thickness of about several ohms is formed between the tantalum film and each of the surface protective film and the interlayer insulating film.
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