abstract |
The present invention includes a semiconductor chip, an FPC tape for mounting the semiconductor chip, a molding resin for protecting the semiconductor chip, and a metal ball formed on the FPC tape and connecting the semiconductor chip to the circuit board. Forming resin is a glass transition temperature of more than 200 ℃, and the linear expansion coefficient in the range of 13 ~ 18 ppm / ℃, then the Young's modulus in the range of 1500 ~ 3000 kg / mm 2, the distortion of the semiconductor device is relaxed. The semiconductor device may also include a buffer layer. The semiconductor device can be manufactured by collectively molding a plurality of semiconductor chips mounted on an FPC tape and cutting the molded product into individual semiconductor packages. |