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filingDate 1998-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1999-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-19990076568-A
titleOfInvention Resin molding semiconductor device and manufacturing method of semiconductor package
abstract The present invention includes a semiconductor chip, an FPC tape for mounting the semiconductor chip, a molding resin for protecting the semiconductor chip, and a metal ball formed on the FPC tape and connecting the semiconductor chip to the circuit board. Forming resin is a glass transition temperature of more than 200 ℃, and the linear expansion coefficient in the range of 13 ~ 18 ppm / ℃, then the Young's modulus in the range of 1500 ~ 3000 kg / mm 2, the distortion of the semiconductor device is relaxed. The semiconductor device may also include a buffer layer. The semiconductor device can be manufactured by collectively molding a plurality of semiconductor chips mounted on an FPC tape and cutting the molded product into individual semiconductor packages.
priorityDate 1998-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 54.