http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19990069439-A
Outgoing Links
Predicate | Object |
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filingDate | 1998-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 1999-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-19990069439-A |
titleOfInvention | Stack chip package |
abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a stack chip package configured by stacking two chips using a tab tape and solder balls. The present invention includes at least two semiconductor chips stacked to face each other; A tab tape having a metal line connected to a bond pad of a first chip of the two semiconductor chips and attached to an upper surface of the first chip, the other end of which is protruded out of the chip and connected to a substrate; A conductive member for electrically connecting the tab tape attached to the first chip and the bond pads of the second chip positioned thereon; An insulating spacer having a rectangular frame shape interposed between edges of the adhesive part of the first chip and the second chip to isolate the inside and the outside of the chip; And an adhesive member interposed between the insulating spacer and the second chip to attach and support the second chip. The stack chip package according to the present invention can increase the memory capacity while improving the appearance (small size and light weight) and can improve the electrical characteristics and reliability. It can also be manufactured in a simple process and can implement high pin contact packages. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100444163-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100646468-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101123797-B1 |
priorityDate | 1998-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.