http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19990069439-A

Outgoing Links

Predicate Object
filingDate 1998-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1999-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-19990069439-A
titleOfInvention Stack chip package
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a stack chip package configured by stacking two chips using a tab tape and solder balls. The present invention includes at least two semiconductor chips stacked to face each other; A tab tape having a metal line connected to a bond pad of a first chip of the two semiconductor chips and attached to an upper surface of the first chip, the other end of which is protruded out of the chip and connected to a substrate; A conductive member for electrically connecting the tab tape attached to the first chip and the bond pads of the second chip positioned thereon; An insulating spacer having a rectangular frame shape interposed between edges of the adhesive part of the first chip and the second chip to isolate the inside and the outside of the chip; And an adhesive member interposed between the insulating spacer and the second chip to attach and support the second chip. The stack chip package according to the present invention can increase the memory capacity while improving the appearance (small size and light weight) and can improve the electrical characteristics and reliability. It can also be manufactured in a simple process and can implement high pin contact packages.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100444163-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100646468-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101123797-B1
priorityDate 1998-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9863
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID93091
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458394858
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451818717
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559503
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9989226
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522015
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID90455
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559550
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159433
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419549006
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559362
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14775
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452908191
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452894838
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579069

Total number of triples: 33.