Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76858 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76876 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76882 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
1998-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1999-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-19990063479-A |
titleOfInvention |
Semiconductor device and manufacturing method thereof |
abstract |
The semiconductor device has a structure in which an Al wiring layer is embedded in a second interior formed in an interlayer insulating film on one main surface of a semiconductor substrate and connected to an Al wiring disposed on the substrate, and at least between the second interior and the Al wiring. An Nb liner film and an NbAl alloy film are interposed. |
priorityDate |
1997-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |