| abstract |
In a heat resistant aromatic polyimide / metal (or metal oxide) composite plate composed of an aromatic polyimide film and a metal or metal oxide layer formed on the film, the polyimide film is dispersed in the aromatic polyimide resin and the polyimide resin And the dispersed amount is 1 to 1,000 ppm with respect to the amount of the polyimide film, and the metal or metal oxide layer is formed on the polyimide film without adhesive. |