http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19990029869-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate | 1998-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1999-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-19990029869-A |
| titleOfInvention | How to form an embedded copper connection and an embedded copper connection structure |
| abstract | A method of forming an embedded copper connection, comprising: forming an insulating layer, forming an embedded copper connection in the insulating layer, planarizing an exposed surface of the insulating layer including an exposed surface of the embedded copper connection, And forming a silver protective thin film on the exposed surface of the embedded copper connection. Repeating the steps on the existing insulating layer thereby producing a multilayer of implied copper connection. The step includes plating the exposed surface of the embedded copper connection with silver by adsorption plating. |
| priorityDate | 1997-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.