| abstract |
Hydroxy-substituted ethynylated biphenyl compounds and reacting these compounds with a thermosetting poly (arylene ether) family of groups that are comparably bonded to form a thin film upon curing at a glass transition temperature of about 350 DEG C or higher, A method for the preparation of novel poly (arylene ether) compositions having properties such as dielectric constant, low moisture absorption, and high thermal stability is disclosed. Such a film is suitable for use as an intermetallic dielectric for multilayer interconnections. |