| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J109-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
1998-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1999-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-19990023270-A |
| titleOfInvention |
Thermosetting adhesive composition |
| abstract |
Provided herein are laminate products associated with thermosetting adhesive compositions and coverlay films, bonding plates, and the like, suitable for use in the manufacture of metal foil laminates of flexible printed wiring boards. The adhesive composition includes (A) an epoxy resin containing a brominated epoxy resin for showing flame retardancy; (B) Combination of two or three different nitrile rubbers distinguishable with respect to the iodine number in the specified weight ratio and the carboxyl group content of the molecular chain ends: (C) a curing agent for epoxy resins; And (D) a curing accelerator for optionally mixing (E) an inorganic filler; And / or (F) a vulcanizing agent for nitrile rubber. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100596995-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220169229-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100677832-B1 |
| priorityDate |
1997-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |