http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19990015556-A
Outgoing Links
| Predicate | Object |
|---|---|
| filingDate | 1997-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1999-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-19990015556-A |
| titleOfInvention | Method of forming pad protective film of semiconductor device |
| abstract | A method of forming a pad protective film of a semiconductor device is disclosed. In a semiconductor device, a bonding pad may be opened to bond wires, and contaminants generated during the test of the semiconductor device may react with moisture to cause corrosion. Therefore, in the present invention, passivation is performed using plasma to prevent such a problem. By the pad protective film obtained by the passivation, contaminants generated in the process step may not be in direct contact with moisture, thereby preventing problems such as corrosion and improving reliability of the semiconductor device. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100724742-B1 |
| priorityDate | 1997-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 12.