| abstract |
The lead 106 provided in the electronic component connector 110 of the electronic component 100 electrically connected to the surface of the substrate 120 is connected to the surface of the substrate 120 through a pressure or an adhesive force applied to the electronic component 100. It is comprised in the manner connected directly to the formed board | substrate connector. These lead structures make it possible to exclude the use of connectors including additional members, such as contact pins, to shorten the length of the transmission path of the electrical signals, and also to make the electrical connections in one position, namely the substrate ( The contact resistance is reduced because it is made between the substrate connector and the lead at 120. |