Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48639 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85439 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4911 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49531 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49575 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 |
filingDate |
1998-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1998-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-19980081439-A |
titleOfInvention |
Semiconductor device |
abstract |
An insulating material and a wiring pattern are provided on at least one surface of the die pad. The wiring of the wiring pattern is formed such that at least one inner lead included in one of the two lead groups is electrically connected to the electrode pad disposed on the element formation surface in the vicinity of the lateral side except the side of the semiconductor chip opposed to the lead group At the same time as patterning, at least one inner lead included in the other lead group is patterned so as to be electrically connected to the electrode pads arranged on the element formation surface in the vicinity of the side surface except the semiconductor chip side facing the lead group. A semiconductor device capable of achieving multi-chip-1-pack cage for all types of semiconductor chips is realized. It is possible to reduce the cost of the device and shorten the development period by avoiding the design change of the semiconductor chip. |
priorityDate |
1997-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |