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filingDate 1998-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1998-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-19980080795-A
titleOfInvention How to test without probing the pad buffer on the wafer
abstract Peripheral circuits 350, 360, ESD, BH of the integrated circuit die on the wafer are tested without physical contact with the bond pads of the die.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100691010-B1
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