| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-564
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3411
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-3407 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-00 |
| filingDate |
1998-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1998-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-19980071126-A |
| titleOfInvention |
Applied vacuum chamber to reduce pump down time and base pressure |
| abstract |
The inner surface of the vacuum chamber is applied with metal or metal oxide to reduce pump down time and base pressure. Metal from the target comprising the metal is sputter deposited in a partially assembled chamber. The chamber is then formed to process a substrate, such as a silicon wafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100421292-B1 |
| priorityDate |
1997-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |