http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19980066140-A
Outgoing Links
| Predicate | Object |
|---|---|
| filingDate | 1997-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1998-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-19980066140-A |
| titleOfInvention | Resin composition for heat-resistant flame-retardant copper foil epoxy laminated board |
| abstract | 1. TECHNICAL FIELD OF THE INVENTIONn n n The present invention is used as a multilayer electronic circuit board, and relates to a resin composition for epoxy copper foil laminate having excellent flame retardancy and heat resistance.n n n 2. The technical problem to be solved by the inventionn n n The resin composition of the present invention improves the heat resistance and flame retardancy of the laminate while solving problems such as harmfulness and metal corrosion due to gas generated during combustion by using red and inorganic flame retardant aids instead of conventional halogen-based flame retardants.n n n 3. Summary of Solution to Inventionn n n The resin composition of the present invention has a total phosphorus content of (B) epoxy resin per 100 g of the total epoxy resin composed of 70 to 99% by weight of (A) bromine-free bisphenol A type epoxy resin and 1 to 30% by weight of epoxy-containing noblock resin. 0.5 to 20 g of (C) dicyanoamide curing agent, 0.01 to 3 g of (D) amidazole-based curing accelerator, and 1 to 150 of (E) inorganic flame retardant aid are included.n n n 4. Important uses of the inventionn n n The resin composition of this invention is used for manufacture of an epoxy copper foil laminated board. |
| priorityDate | 1997-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.