http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19980064561-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0773 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1997-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1998-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-19980064561-A |
| titleOfInvention | Interlayer adhesive film for multilayer printed wiring boards and multilayer printed wiring boards using the same |
| abstract | The present invention relates to an interlayer adhesive film for multilayer printed wiring boards bonded to an inner layer circuit board, wherein the film is embedded in an inner layer circuit and bonded.n n n The adhesive film is produced with high productivity, and the resin filling into the inner layer circuit pattern and through-holes and / or surface via holes by a lamination process of manufacturing a multilayer printed wiring board in which a conductor circuit layer and an insulating layer are alternately laminated together. Can be performed at essentially the same time.n n n The present invention also relates to an adhesive film for multilayer printed wiring boards in which both a support substrate film processed with a pattern and a resin composition solid at ambient temperature are laminated on an inner layer circuit board, and a method for producing a multilayer printed wiring board using the film. will be. Here, the resin composition that is solid at ambient temperature contains at least 10% by weight of a resin having a softening point lower than the laminate temperature, the thickness is thicker than the conductor thickness in the inner layer circuit, and the resin flow of the resin composition at the laminate temperature is the inner layer. It is equal to or greater than the thickness of the conductor in the circuit, or if the surface via hole is present in the inner layer circuit, or the depth of the surface through hole in the inner layer circuit, or the depth of the through hole in the inner layer circuit or more than 1/2 times the depth combined with the surface via hole. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100380722-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7955689-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7749605-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7749612-B2 |
| priorityDate | 1996-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 67.