http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19980054909-A

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4821
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F5-00
filingDate 1996-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1998-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-19980054909-A
titleOfInvention Electrochemical silver release agent used in leadframe manufacturing process
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silver stripping solution used for electrochemically peeling a silver plated portion of an unwanted portion in silver plating of a copper or copper alloy, nickel or nickel alloy substrate, and more particularly, in a lead frame manufacturing process. The present invention relates to a silver release agent for peeling off unwanted portions after silver plating is performed on specific regions.n n n The present invention is a group of 50 to 550 g / L alkali metal and alkaline earth metal compound in the silver release agent for selectively peeling the silver plated region on the lead frame during the manufacturing process of the lead frame based on copper or copper alloy It is characterized in that a compound selected from the group consisting of a compound selected from the group consisting of sodium tetraborate, potassium quadruple potassium and potassium hydrogen phthalate.n n n The present invention selectively peels the silver strike plated portion or the silver bleed portion without any damage to the selectively silver plated region, and in this process, the deposition reaction between the silver ions and the copper surface existing in the solution after the peeling and copper No black spots are produced by the formation of polymers of the Si component present in the alloy.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100322499-B1
priorityDate 1996-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 39.