| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system and method for sorting reliability for semiconductor wafers, and in particular, comprising a high planarity device and wafer level burnin (WLBI), die die burnin (DDBI), and package die burnin (PDBI). It is about the use method. The burn-in system includes a burn-in substrate having a planar base, a temporary Z-axis connecting member and a Z-axis wafer level contact sheet electrically coupled to each other for sorting wafers, dies and packaged electrical components. |