http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19980027449-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4261 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L45-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L93-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1996-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1998-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-19980027449-A |
| titleOfInvention | Epoxy resin composition for sealing semiconductor elements and semiconductor device using same |
| abstract | The present invention relates to an epoxy resin composition for sealing semiconductor elements and a semiconductor device sealed with the composition. According to the present invention, a semiconductor device comprising two or more selected from rosin ester, styrene butadiene resin and indene resin as a special additive in an epoxy resin composition for sealing a semiconductor device comprising an epoxy resin, a curing agent, an inorganic filler, a curing accelerator, and a coupling agent. The epoxy resin composition for encapsulation satisfies general physical properties such as mechanical strength, moldability, moisture resistance, etc., and has higher adhesiveness and crack resistance than the conventional epoxy resin composition for semiconductor encapsulation, thereby providing high reliability for high-density surface mount package encapsulation. Indicates. |
| priorityDate | 1996-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.