http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19980026079-A
Outgoing Links
Predicate | Object |
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filingDate | 1996-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 1998-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-19980026079-A |
titleOfInvention | Contact hole formation method of semiconductor device |
abstract | A method for forming a contact hole in a semiconductor device is described. This is a fluoro-based gas in which trifluoro methane (CHF 3 ) and tetrafluoro carbon (CF 4 ) are mixed in a process of forming a photoresist pattern on an etched layer and in a magnetic enhanced reactive ion etching (MERIE) facility. And etching the etching target layer. Therefore, according to the present invention, contact holes having a fine size can be formed without performing a complicated process such as forming a polysilicon layer. |
priorityDate | 1996-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 14.