| abstract |
[Problem] To provide a resin composition capable of obtaining an insulating layer in which a decrease in dielectric constant and an improvement in adhesion to a conductor layer are compatible. [Solution] A resin composition comprising component (A) epoxy resin, component (B) active ester compound, component (C) inorganic filler, and component (D) fluorine-based filler, wherein 100 mass of the non-volatile component in the resin composition In the case of %, the content of the component (D) is 10% by mass to 40% by mass, and the sum of the contents of the component (C) and the component (D) is 100% by mass, the component ( D) is 20% by mass to 70% by mass, the resin composition. |