| titleOfInvention |
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed-wiring board |
| abstract |
A copper heat dissipation material having good heat dissipation properties is provided. A laser microscope in which an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn, and Mo is formed on one or both surfaces, and the wavelength of laser light is 405 nm. A copper heat dissipation material having a surface roughness Sz of one or both surfaces measured by 5 µm or more. |