http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102471850-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-56 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68728 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68785 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate | 2018-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102471850-B1 |
| titleOfInvention | Processing method |
| abstract | An object of the present invention is to provide a processing method capable of increasing the processing speed while maintaining processing quality when processing a plate-shaped workpiece formed by overlapping a laminated body including metal on a line to be cut. A processing method for processing a plate-shaped workpiece in which a laminate containing metal is formed on the back side, wherein a holding step of holding the back side of the workpiece with a holding table, and a wavelength having absorption for the workpiece after the holding step is performed After the laser processing step of irradiating the surface of the workpiece along the line to be cut with a laser beam to form a laser processing groove that does not reach the laminate, and the laser processing step, the bottom of the laser processing groove is cut with a cutting blade. and a cutting step of cutting the workpiece together with the laminated body along a line to be cut, and in the cutting step, cutting is performed while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece. |
| priorityDate | 2017-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 156.