| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate |
2016-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102461845-B1 |
| titleOfInvention |
Etching solutions for copper and copper alloy surfaces |
| abstract |
Aqueous etching for copper and copper alloy surfaces comprising at least one acid, at least one oxidizing agent suitable for oxidizing copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) solution: (wherein each a is independently selected from 2 and 3; each b is independently from each other an integer in the range of 5 to 10000; each R 1 is a substituted or unsubstituted C1-C8-alkyl group monovalent residues independently selected from the group consisting of), and methods of using the same. Such etching solutions are particularly useful for maintaining the shape of processed copper and copper alloy lines. |
| priorityDate |
2015-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |