http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102460134-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0236 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 |
| filingDate | 2015-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102460134-B1 |
| titleOfInvention | Photoresist composition for copper layer |
| abstract | The present invention relates to a photoresist composition for a copper film. More specifically, the photoresist composition contains a thiadiazole-based compound having a specific structure in a predetermined content range, thereby improving the etching performance on the copper film substrate compared to the existing one, thereby improving the adhesion to the substrate and the circuit line width uniformity at the same time. A photoresist composition for a copper film is provided. |
| priorityDate | 2015-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 126.