http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102455212-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-89 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate | 2017-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102455212-B1 |
| titleOfInvention | Semiconductor device, semiconductor device manufacturing method and adhesive |
| abstract | The first member having the connecting portion and the second member having the connecting portion are pressed through a thermosetting adhesive at a temperature lower than the melting point of the connecting portion of the first member and the melting point of the connecting portion of the second member, whereby the connecting portion of the first member and the second member having the connecting portion are pressed together. A temperature above the melting point of at least one of the connecting portion of the first member or the connecting portion of the second member by the step of obtaining a pressure bonding body in which the connecting portions of the two members are opposed to each other, and sandwiching the pressure bonding body between a pair of opposingly arranged pressing members A method of manufacturing a semiconductor device comprising a step of obtaining a crimped body by pressing while heating with a furnace, and a step of further heating the crimped body in a pressurized atmosphere is disclosed. The first member is a semiconductor chip or semiconductor wafer, and the second member is a wiring circuit board, semiconductor chip or semiconductor wafer. |
| priorityDate | 2017-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.