abstract |
While suppressing damage or shape change of layers other than the target layer such as the substrate or the interlayer insulating film by using a non-special device such as a coater, a bake furnace (cure furnace), or a cleaning chamber mounted in a semiconductor manufacturing device, To provide a cleaning composition capable of removing a target layer favorably, a cleaning method using the cleaning composition, and a semiconductor manufacturing method using the cleaning method. The to-be-processed layer formed on the board|substrate is wash|cleaned using the cleaning composition containing the component (A) which can decompose|disassemble the to-be-processed layer, and the film-forming polymer (B). A hard mask film is mentioned as a to-be-processed layer. As a component (A), at least 1 selected from a basic compound (A1) and an acidic compound (A2) is mentioned. |