http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102434778-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-145 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate | 2015-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102434778-B1 |
| titleOfInvention | Light emitting device package |
| abstract | The light emitting device package of the embodiment includes a substrate, a light emitting structure including a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer, which is disposed under the substrate, and passes through the active layer and the second conductivity type semiconductor layer. A first bonding pad buried in the through hole exposing the conductive semiconductor layer and connected to the first conductive semiconductor layer, spaced apart from the first bonding pad and disposed under the second conductive semiconductor layer, the second conductive semiconductor layer; The connected second bonding pad, the first insulating layer disposed on the side of the light emitting structure and the inner lower edge of the light emitting structure in the through hole, and the second insulating layer disposed between the first insulating layer and the first bonding pad in the through hole include layers. |
| priorityDate | 2015-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.