| abstract |
The present invention contains (A) a urethane resin obtained by reacting polycarbonate diol with an isocyanate, (B) an epoxy resin, and (C) a filler, (A) the carboxyl group equivalent of the urethane resin is 1,100-5,700 g/equivalent, , (A) with respect to 1.0 equivalent of the carboxyl group of the urethane resin (B) the epoxy equivalent of the epoxy resin is 0.3 to 4.5 equivalents, (A) the weight average molecular weight of the urethane resin is 5,000 to 80,000, (A) polycarbonate in the urethane resin The content is 35 mass % or less, (A) 50 mass parts or less of (C) fillers are contained with respect to 100 mass parts of urethane resin, The low-k dielectric resin composition which does not contain an imide group substantially in a resin composition is provided. |