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filingDate 2017-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102429088-B1
titleOfInvention Copper foil with enhanced adhesion property by having imidazole compound layer, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same
abstract An embodiment of the present invention includes a copper layer, an anti-rust film disposed on the copper layer, and an imidazole compound layer disposed on the anti-rust film, wherein the imidazole compound layer has a mercapto group. A copper foil containing a dazole compound is provided.
priorityDate 2017-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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