Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D7-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-661 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-667 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D4-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M10-052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-14 |
filingDate |
2017-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2022-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-102429088-B1 |
titleOfInvention |
Copper foil with enhanced adhesion property by having imidazole compound layer, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same |
abstract |
An embodiment of the present invention includes a copper layer, an anti-rust film disposed on the copper layer, and an imidazole compound layer disposed on the anti-rust film, wherein the imidazole compound layer has a mercapto group. A copper foil containing a dazole compound is provided. |
priorityDate |
2017-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |