http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102429042-B1
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
filingDate | 2015-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2022-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2022-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-102429042-B1 |
titleOfInvention | Ceramic Board Manufacturing Method |
abstract | The present invention relates to a method for manufacturing a ceramic substrate and to a ceramic substrate manufactured by the manufacturing method. A ceramic substrate having a seed layer formed thereon, and a plurality of metal foil patterns connected by bridges to match a pre-designed circuit pattern by processing a metal foil, are prepared, and the ceramic substrate A plurality of cut or punched metal foil patterns are connected by a bridge by brazing with a brazing filler layer interposed between the substrate and the metal foil pattern, brazing the metal foil pattern onto the ceramic substrate, and then removing the bridge. Brazing can be performed by accurately positioning it on the ceramic substrate according to the shape of the circuit pattern, thereby preventing defects in the brazing bonding process and greatly improving the adhesion between the metal foil pattern and the ceramic substrate. |
priorityDate | 2015-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447595485 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID166656 |
Total number of triples: 15.