http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102428185-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D2350-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1208 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate | 2017-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102428185-B1 |
| titleOfInvention | Method of electrodeposition thereof comprising activation of a metal or metal alloy onto the surface of a substrate |
| abstract | The present invention relates to a method for electrodepositing a metal or metal alloy on at least one surface of a substrate comprising the steps of: (a) providing the substrate; (b) activating the surface of the substrate with an activation solution comprising a source of one or more metal ions selected from the group consisting of ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, silver, nickel, cobalt, gold and mixtures thereof. treating such that one or more portions of the metal ions are adsorbed onto the surface of the substrate; (c) treating the surface of the substrate obtained from step (b) with a treatment solution comprising: i) at least one additive independently selected from the group consisting of thiols, thioethers, disulfides and sulfur containing heterocycles, and ii) boron-based reducing agent, source of hypophosphite ion, hydrazine and hydrazine derivatives, ascorbic acid, iso-ascorbic acid, source of formaldehyde, glyoxylic acid, source of glyoxylic acid, glycolic acid, formic acid, sugars, and the above at least one reducing agent suitable for reducing metal ions adsorbed on the surface of the substrate selected from the group consisting of salts of the acids mentioned; and (d) treating the surface obtained from step (c) of the substrate with a metallization solution comprising a solvent and a source of one or more metal ions to be electrodeposited, such that a metal or metal alloy is electrodeposited thereon. Substrate metallization methods are mostly useful in the electronics industry, but are also applicable to metallization methods of typical non-conductive substrates such as plastics. The method is cost-effective and ecologically advantageous, due to its reduction in the essential amount of its total chemicals. |
| priorityDate | 2016-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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