| abstract |
[Problem] To provide a resin composition from which a cured product capable of forming a conductor layer having high peel strength on the surface while being excellent in warpage suppression properties and smear removal properties is provided. [Solutions] A resin composition containing (A) an epoxy resin and (B) a curing agent, wherein (A) the epoxy resin contains (A1) an epoxy resin having a biphenyl skeleton and a diglycidyloxybenzene skeleton, or , (A2) comprising an epoxy resin represented by Formula 1, (B) A resin composition comprising at least one curing agent selected from a phenol-based curing agent, a cyanate ester-based curing agent, and an active ester-based curing agent. [Formula 1] |