| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-55 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12 |
| filingDate |
2018-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102402138-B1 |
| titleOfInvention |
Negative photosensitive resin composition, manufacturing method thereof, and manufacturing method of cured relief pattern |
| abstract |
The present invention provides a negative photosensitive resin composition capable of suppressing the generation of voids at the interface of the Cu layer in contact with the resin layer after a high-resolution storage test and a high-temperature storage test, a method for producing the same, and the formation of a curing relief pattern provide a way The negative photosensitive resin composition of this invention is (A) polyimide precursor; (B) has a plurality of amino groups protected with an acid or base or a group deprotected by heat, the molecular weight is 250 to 600, the protected plurality of amino groups is an aliphatic chain or alicyclic amino group, and the solubility parameter has a value of 20.0 The base protection compound which is 24.0 or more and 24.0 or less; and (C) a photoinitiator. |
| priorityDate |
2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |