abstract |
[Problem] A resin composition in which warpage is suppressed and excellent in strength and adhesion; Provision of a resin sheet, a circuit board, and a semiconductor chip package using the same. [Solutions] (a) an elastomer having a polycarbonate structure in a molecule, (b) an epoxy resin, (c) an inorganic filler, (d) a phenoxy resin, and (e) a resin composition containing a carbodiimide compound, etc. will be. |