http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102400258-B1

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filingDate 2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102400258-B1
titleOfInvention Etchant composition for etching metal layer and manufacturing method of forming conductive pattern using the same
abstract The present invention relates to a metal film etchant composition, and more particularly, 40 to 60% by weight of phosphoric acid, based on the total weight of the composition; 3 to 8% by weight of nitric acid; 5 to 20% by weight of acetic acid; 0.1 to 3% by weight of phosphate; 0.1 to 6% by weight of an anti-adsorption agent comprising at least one of a glycol-based compound or a polyphosphate group-containing compound; and a residual amount of water, effectively preventing the etched metal from being re-adsorbed on the substrate, and exhibiting excellent etching properties for the target layer without damaging the underlying layer.
priorityDate 2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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