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filingDate 2017-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102399930-B1
titleOfInvention Method for manufacturing copper foil having nodule layer, copper foil manufactured by the method, electrode for secondary battery the same and secondary battery
abstract An embodiment of the present invention includes forming a copper layer and forming a nodular layer on the copper layer, wherein the forming of the nodular layer comprises 7 to 10 g/L of copper ions, 90 to Preparing a plating solution containing 120 g/L sulfuric acid and 13 to 17 g/L metal ions, immersing the copper layer in the plating solution, spaced apart from the copper layer, and disposed in the plating solution, and the It provides a method of manufacturing a copper foil comprising forming a plurality of nodules on the copper layer by applying a current at a current density of 10 to 25 A/dm 2 between the copper layers.
priorityDate 2017-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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