titleOfInvention |
Polyimide, adhesive, film-shaped adhesive material, adhesive layer, adhesive sheet, copper foil with resin, copper clad laminate, printed wiring board, and multi-layer board and manufacturing method thereof |
abstract |
<task> An object of the present invention is to provide a polyimide, an adhesive, a film adhesive, an adhesive layer, an adhesive sheet, a resin-coated copper foil, a copper-clad laminate, a printed wiring board, a multilayer wiring board, and a method for manufacturing the same. <Solutions> A polyimide that is a reactant of a group of monomers containing an aromatic tetracarboxylic anhydride and a diamine containing dimerdiamine, and a polyimide containing a fluorenylene group in the polymer main chain, and an adhesive containing a polyimide, a crosslinking agent and an organic solvent, and a film adhesive; A solution is to provide an adhesive layer, an adhesive sheet, a resin-coated copper foil, a copper-clad laminate, a printed wiring board, and a multilayer wiring board and a manufacturing method thereof. |