| abstract |
Embodiments herein relate to methods and apparatus for electroplating one or more materials on a substrate. Typically, embodiments herein utilize a channeled plate positioned proximate the substrate, creating a cross flow manifold between the channeled plate and the substrate and on the sides by a flow confinement ring. A sealing may be provided between the bottom surface of the substrate holder and the top surface of an element under the substrate holder (eg, a flow confinement ring). During plating, fluid enters the cross-flow manifold through the channels of the channeled plate and through a cross-flow inlet, and later exits at a cross-flow outlet located opposite the cross-flow inlet. The apparatus may switch between a sealed and unsealed state during electroplating, for example, by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the sealing. |