Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0779 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-06 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A01N43-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-63 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A01N25-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-08 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A01N25-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A01N43-52 |
filingDate |
2017-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2022-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-102380459-B1 |
titleOfInvention |
Water-based organic solderability preservative, and electronic board and surface treatment method using the same |
abstract |
The water-soluble preflux of the present invention contains (A) an imidazole compound, (B) an organic acid, (C) a complex film forming aid, (D) an organic solvent, and (E) water; The organic solvent has a solubility in water of 10 g/100 g or more at a temperature of 20°C and a boiling point of 100°C or more and 300°C or less. |
priorityDate |
2016-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |