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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02249
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
filingDate 2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102378930-B1
titleOfInvention Etchant composition for etching nitride layer and method of forming pattern using the same
abstract The nitride layer etching composition of the present invention includes phosphoric acid, a silane ammonium-based compound in which two or more ammonium groups are bonded per one silicon (Si) atom, and excess water. The nitride layer can be etched with a high selectivity by using the nitride layer etching composition without damage to the oxide layer and re-adsorption of etch residues.
priorityDate 2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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