| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate |
2015-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102376223-B1 |
| titleOfInvention |
Adhesive composition, anisotropically conductive adhesive composition, circuit connection material and connection body |
| abstract |
The present invention contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, and (d) an epoxy resin having no (meth)acryloyloxy group, and a cationic polymerization curing agent for the epoxy resin. It relates to an adhesive composition substantially free of it. |
| priorityDate |
2015-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |