| abstract |
[Problem] In order to obtain an insulating resin material, which is a material that achieves both an excellent low dielectric constant and a low thermal coefficient of thermal expansion, which is difficult to obtain in the past, an insulating resin material with a metal layer and a wiring board using the same, having hollow holes 3 composed of a plurality of fine particles An insulating resin material containing a porous inorganic aggregate (2) and fibrils (4) made of polytetrafluoroethylene, wherein the fibrils (4) are oriented in multiple directions, the porous inorganic aggregate (2) and fibrils (4) Provided is an insulating resin material in which at least one of (4) is interconnected and is a fine mesh structure having a porosity of 50% or more. |