| abstract |
In general, this disclosure provides exemplary embodiments relating to conductive features, such as metal contacts, vias, lines, and the like, and methods of forming those conductive features. In one embodiment, a barrier layer is formed along the sidewall. A portion of the barrier layer along the sidewall is etched back by a wet etch process. After etching back portions of the barrier layer, the underlying dielectric welding layer is exposed. A conductive material is formed along the barrier layer. |